Basic Soldering For Electronics Pace Handbook Of North

Basic Soldering For Electronics Pace Handbook Of North American
Basic Soldering For Electronics Pace Handbook Of North Africa

Basic Soldering for Electronics Lesson 1 - 'Solder and Flux' produced by PACE, Inc. Install electrical and electronic components, assemblies, and systems in aircraft, using hand tools, power tools, or soldering irons. Set up and operate ground support and test equipment to perform functional flight tests of electrical and electronic systems.

7.1.1 Soldering Basics

Outline
This procedure covers the basic concepts for high quality soldering.
Minimum Skill Level - Intermediate
Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.

Acceptability References
IPC-A-610 3.0	Handling Electronic Assemblies
IPC-A-610 5.0	Component Installation
IPC-A-610 6.0	Soldering
IPC-A-610 7.0	Cleanliness
Procedure References
1.0	Foreword
2.1	Handling Electronic Assemblies
2.2	Cleaning
2.5	Baking And Preheating
7.1.2	Preparation For Soldering

Tools and Materials

Images and Figures

Figure 1: Wetting occurs when molten solder penetrates a copper surface, forming an intermetallic bond.

Figure 2: Minimal thermal linkage due to insufficient solder between the pad and soldering iron tip.

Figure 3: A solder bridge provides thermal linkage to transfer heat into the pad and component lead.

Figure 4: Solder blends to the soldered surface, forming a small contact angle.

Soldering Process
Soldering is the process of joining two metals by the use of a solder alloy, and it is one of the oldest known joining techniques. Faulty solder joints remain one of the major causes of equipment failure and thus the importance of high standards of workmanship in soldering cannot be overemphasized.
The following material covers basic soldering procedures and has been designed to provide the fundamental knowledge needed to complete the majority of high reliability hand soldering and component removal operations.
Properties of Solder
Solder used for electronics is a metal alloy, made by combining tin and lead in different proportions. You can usually find these proportions marked on the various types of solder available.
With most tin/lead solder combinations, melting does not take place all at once. Fifty-fifty solder begins to melt at 183 C -361 F, but it's not fully melted until the temperature reaches 216 C - 420 F. Between these two temperatures, the solder exists in a plastic or semi-liquid state.
The plastic range of a solder varies, depending upon the ratio of tin to lead. With 60/40 solder, the range is much smaller than it is for 50/50 solder. The 63/37 ratio, known as eutectic solder has practically no plastic range, and melts almost instantly at 183 C -361 F.
The solders most commonly used for hand soldering in electronics are the 60/40 type and the 63/37 type. Due to the plastic range of the 60/40 type, you need to be careful not to move any elements of the joint during the cool down period. Movement may cause what is known as disturbed joint. A disturbed joint has a rough, irregular appearance and looks dull instead of bright and shiny. A disturbed solder joint may be unreliable and may require rework.
Wetting Action
When the hot solder comes in contact with a copper surface, a metal solvent action takes place. The solder dissolves and penetrates the copper surface. The molecules of solder and copper blend to form a new alloy, one that's part copper and part solder. This solvent action is called wetting and forms the intermetallic bond between the parts. (See Figure 1) Wetting can only occur if the surface of the copper is free of contamination and from the oxide film that forms when the metal is exposed to air. Also, the solder and work surface need to have reached the proper temperature.
Although the surfaces to be soldered may look clean, there is always a thin film of oxide covering it. For a good solder bond, surface oxides must be removed during the soldering process using flux.
Flux
Reliable solder connections can only be accomplished with truly cleaned surfaces. Solvents can be used to clean the surfaces prior to soldering but are insufficient due to the extremely rapid rate at which oxides form on the surface of heated metals. To overcome this oxide film, it becomes necessary in electronic soldering to use materials called fluxes. Fluxes consist of natural or synthetic rosins and sometimes chemical additives called activators.
It is the function of the flux to remove oxides and keep them removed during the soldering operation. This is accomplished by the flux action which is very corrosive at solder melt temperatures and accounts for flux's ability to rapidly remove metal oxides. In its unheated state, however, rosin flux is non-corrosive and non-conductive and thus will not affect the circuitry. It is the fluxing action of removing oxides and carrying them away, as well as preventing the reformation of new oxides that allows the solder to form the desired intermetallic bond.
Flux must melt at a temperature lower than solder so that it can do its job prior to the soldering action. It will volatilize very rapidly; thus it is mandatory that flux be melted to flow onto the work surface and not be simply volatilized by the hot iron tip to provide the full benefit of the fluxing action. There are varieties of fluxes available for many purposes and applications. The most common types include: Rosin - No Clean, Rosin - Mildly Activated and Water Soluble.
When used, liquid flux should be applied in a thin, even coat to those surfaces being joined and prior to the application of heat. Cored wire solder and solder paste should be placed in such a position that the flux can flow and cover the joints as the solder melts. Flux should be applied so that no damage will occur to the surrounding parts and materials.
Soldering Irons
Soldering irons come in a variety of sizes and shapes. A continuously tinned surface must be maintained on the soldering iron tip's working surface to ensure proper heat transfer and to avoid transfer of impurities to the solder connection.
Before using the soldering iron the tip should be cleaned by wiping it on a wet sponge. When not in use the iron should be kept in a holder, with its tip clean and coated with a small amount of solder
Note
Although tip temperature is not the key element in soldering you should always start at the lowest temperature possible. A good rule of thumb is to set the soldering iron tip temperature at 260 C - 500 F and increase the temperature as needed to obtain the desired result.
Controlling Heat
Controlling soldering iron tip temperature is not the key element in soldering. The key element is controlling the heat cycle of the work. How fast the work gets hot, how hot it gets, and how long it stays hot is the element to control for reliable solder connections.
Thermal Mass
The first factor that needs to be considered when soldering is the relative thermal mass of the joint to be soldered. This mass may vary over a wide range.
Each joint, has its own particular thermal mass, and how this combined mass compares with the mass of the iron tip determines the time and temperature rise of the work.
Surface Condition
A second factor of importance when soldering is the surface condition. If there are any oxides or other contaminants covering the pads or leads, there will be a barrier to the flow of heat. Even though the iron tip is the right size and temperature, it may not be able to supply enough heat to the joint to melt the solder.
Thermal Linkage
A third factor to consider is thermal linkage. This is the area of contact between the iron tip and the work.
Figure 2 shows a view of a soldering iron tip soldering a component lead. Heat is transferred through the small contact area between the soldering iron tip and pad. The thermal linkage area is small.
Figure 3 also shows a view of a soldering iron tip soldering a component lead. In this case, the contact area is greatly increased by having a small amount of solder at the point of contact. The tip is also in contact with both the pad and component further improving the thermal linkage. This solder bridge provides thermal linkage and assures the rapid transfer of heat into the work.
Applying Solder
In general, the soldering iron tip should be applied to the maximum mass point of the joint. This will permit the rapid thermal elevation of the parts to be soldered. Molten solder always flows from the cooler area toward the hotter one.
Before solder is applied; the surface temperature of the parts being soldered must be elevated above the solder melting point. Never melt the solder against the iron tip and allow it to flow onto a surface cooler than the solder melting temperature. Solder applied to a cleaned, fluxed and properly heated surface will melt and flow without direct contact with the heat source and provide a smooth, even surface, filleting out to a thin edge. Improper soldering will exhibit a built-up, irregular appearance and poor filleting. For good solder joint strength, parts being soldered must be held in place until the solder solidifies.
If possible apply the solder to the upper portion of the joint so that the work surfaces and not the iron will melt the solder, and so that gravity will aid the solder flow. Selecting cored solder of the proper diameter will aid in controlling the amount of solder being applied to the joint. Use a small gauge for a small joint, and a large gauge for a large joint.
Post Solder Cleaning
When cleaning is required, flux residue should be removed as soon as possible, but no later than one hour after soldering. Some fluxes may require more immediate action to facilitate adequate removal. Mechanical means such as agitation, spraying, brushing, and other methods of applications may be used in conjunction with the cleaning solution.
The cleaning solvents, solutions and methods used should not have affected the parts, connections, and materials being cleaned. After cleaning, boards should be adequately dried.
Resoldering
Care should be taken to avoid the need for resoldering. When resoldering is required, quality standards for the resoldered connection should be the same as for the original connection.
A cold or disturbed solder joint will usually require only reheating and reflowing of the solder with the addition of suitable flux. If reheating does not correct the condition, the solder should be removed and the joint resoldered.
Workmanship
Solder joints should have a smooth appearance. A satin luster is permissible. The joints should be free from scratches, sharp edges, grittiness, looseness, blistering, or other evidence of poor workmanship. Probe marks from test pins are acceptable providing that they do not affect the integrity of the solder joint.
An acceptable solder connection should indicate evidence of wetting and adherence when the solder blends to the soldered surface. The solder should form a small contact angle; this indicates the presence of a metallurgical bond and metallic continuity from solder to surface. (See Figure 4)
Smooth clean voids or unevenness on the surface of the solder fillet or coating are acceptable. A smooth transition from pad to component lead should be evident.

Procedure for reference only.

Learning how to solder w/ proper soldering techniques is a fundamental skill every maker should master. In this tutorial, we outline the basics of soldering irons, soldering stations, types of solder, desoldering and safety tips. Whether you’re building a robot or working with Arduino, knowing how to solder will come in handy.

FREE EBOOK (PDF) – Learn To Solder Guide (17 pages)

If you were to take apart any electronic device that contains a circuit board, you’ll see the components are attached using soldering techniques. Soldering is the process of joining two or more electronic parts together by melting solder around the connection. Solder is a metal alloy and when it cools it creates a strong electrical bond between the parts. Even though soldering can create a permanent connection, it can also be reversed using a desoldering tool as described below.

The good thing about learning how to solder is the fact that you don’t need a lot to get started. Below we’ll outline the basic tools and materials you will need for most of your soldering projects.

Soldering Iron

A soldering iron is a hand tool that plugs into a standard 120v AC outlet and heats up in order to melt solder around electrical connections. This is one of the most important tools used in soldering and it can come in a few variations such as pen or gun form. For beginners, it’s recommended that you use the pen style soldering iron in the 15W to 30W range. Most soldering irons have interchangeable tips that can be used for different soldering applications. Be very cautious when using any type of soldering iron because it can heat up to 896′ F which is extremely hot.

Soldering Station

A soldering station is a more advanced version of the basic standalone soldering pen. If you are going to be doing a lot of soldering, these are great to have as they offer more flexibility and control. The main benefit of a soldering station is the ability to precisely adjust the temperature of the soldering iron which is great for a range of projects. These stations can also create a safer workspace as some include advanced temperature sensors, alert settings and even password protection for safety.

Soldering Iron Tips

At the end of most soldering irons is an interchangeable part known as a soldering tip. There are many variations of this tip and they come in a wide variety of shapes and sizes. Each tip is used for a specific purpose and offers a distinct advantage over another. The most common tips you will use in electronics projects are the conical tip and the chisel tip.

Conical Tip – Used in precision electronics soldering because of the fine tip. Because of its pointed end, it’s able to deliver heat to smaller areas without affecting its surroundings.

Chisel Tip – This tip is well-suited to soldering wires or other larger components because of its broad flat tip.

Brass or Conventional Sponge

Using a sponge will help to keep the soldering iron tip clean by removing the oxidation that forms. Tips with oxidation will tend to turn black and not accept solder as it did when it was new. You could use a conventional wet sponge but this tends to shorten the lifespan of the tip due to expansion and contraction. Also, a wet sponge will drop the temperature of the tip temporarily when wiped. A better alternative is to use a brass sponge as shown on the left.

Soldering Iron Stand

A soldering iron stand is very basic but very useful and handy to have. This stand helps prevent the hot iron tip from coming in contact with flammable materials or causing accidental injury to your hand. Most soldering stations come with this built in and also include a sponge or brass sponge for cleaning the tip.

Solder

Solder is a metal alloy material that is melted to create a permanent bond between electrical parts. It comes in both lead and lead-free variations with diameters of .032″ and .062″ being the most common. Inside the solder core is a material known as flux which helps improve electrical contact and its mechanical strength.

For electronics soldering, the most commonly used type is lead-free rosin core solder. This type of solder is usually made up of a Tin/Copper alloy. You can also use leaded 60/40 (60% tin, 40% lead) rosin core solder but it’s becoming less popular due to health concerns. If you do use lead solder, make sure you have proper ventilation and that you wash your hands after use.

When buying solder, make sure NOT to use acid core solder as this will damage your circuits and components. Acid core solder is sold at home improvement stores and is mainly used for plumbing and metal working.

As mentioned earlier, solder does come in a few different diameters. The thicker diameter solder (.062″) is good for soldering larger joints more quickly but it can make soldering smaller joints difficult. For this reason, it’s always a good idea to have both sizes on hand for your different projects.

Helping Hand (Third Hand)

A helping hand is a device that has 2 or more alligator clips and sometimes a magnifying glass/light attached. This clips will assist you by holding the items you are trying to solder while you use the soldering iron and solder. A very helpful tool to have in your makerspace.

Now that you know what tools and materials are required, it’s time to briefly discuss ways of staying safe while soldering.

Soldering irons can reach temperatures of 800′ F so it’s very important to know where your iron is at all times. We always recommend you use a soldering iron stand to help prevent accidental burns or damage.

Make sure you are soldering in a well ventilated area. When solder is heated, there are fumes released that are harmful to your eyes and lungs. It’s recommended to use a fume extractor which is a fan with a charcoal filter that absorbs the harmful solder smoke you can visit sites like Integrated Air Systems for air filtration systems.

It’s always a good idea to wear protective eye wear in case of accidental splashes of hot solder. Lastly, make sure to wash your hands when done soldering especially if using lead solder.

Basic Soldering For Electronics Pace Handbook Of North

Before you can start soldering, you need to prep your soldering iron by tinning the tip with solder. This process will help improve the heat transfer from the iron to the item you’re soldering. Tinning will also help to protect the tip and reduce wear.

Step 1: Begin by making sure the tip is attached to the iron and screwed tightly in place.

Step 2: Turn on your soldering iron and let it heat up. If you have a soldering station with an adjustable temp control, set it to 400′ C/ 752′ F.

Step 3: Wipe the tip of the soldering iron on a damp wet sponge to clean it. Wait a few seconds to let the tip heat up again before proceeding to step 4.

Step 4: Hold the soldering iron in one hand and solder in the other. Touch the solder to the tip of the iron and make sure the solder flows evenly around the tip.

You should tin the tip of your iron before and after each soldering session to extend its life. Eventually, every tip will wear out and will need replacing when it becomes rough or pitted.

To better explain how to solder, we’re going to demonstrate it with a real world application. In this example, we’re going to solder an LED to a circuit board.

Step 1: Mount The Component – Begin by inserting the leads of the LED into the holes of the circuit board. Flip the board over and bend the leads outward at a 45′ angle. This will help the component make a better connection with the copper pad and prevent it from falling out while soldering.

Step 2: Heat The Joint – Turn your soldering iron on and if it has an adjustable heat control, set it to 400’C. At this point, touch the tip of the iron to the copper pad and the resistor lead at the same time. You need to hold the soldering iron in place for 3-4 seconds in order to heat the pad and the lead.

Step 3: Apply Solder To Joint – Continue holding the soldering iron on the copper pad and the lead and touch your solder to the joint. IMPORTANT – Don’t touch the solder directly to the tip of the iron. You want the joint to be hot enough to melt the solder when it’s touched. If the joint is too cold, it will form a bad connection.

Step 4: Snip The Leads– Remove the soldering iron and let the solder cool down naturally. Don’t blow on the solder as this will cause a bad joint. Once cool, you can snip the extra wire from leads.

A proper solder joint is smooth, shiny and looks like a volcano or cone shape. You want just enough solder to cover the entire joint but not too much so it becomes a ball or spills to a nearby lead or joint.

Now it’s time to show you how to solder wires together. For this process, it’s recommended to use helping hands or other type of clamp device.

Begin by removing the insulation from the ends of both wires you are soldering together. If the wire is stranded, twist the strands together with your fingers.

Make sure your soldering iron is fully heated and touch the tip to the end of one of the wires. Hold it on the wire for 3-4 seconds.

Keep the iron in place and touch the solder to the wire until it’s fully coated. Repeat this process on the other wire.

Hold the two tinned wires on top of each other and touch the soldering iron to both wires. This process should melt the solder and coat both wires evenly.

Remove the soldering iron and wait a few seconds to let the soldered connection cool and harden. Use heat shrink to cover the connection.

Basic Soldering For Electronics Pace Handbook Of North American

The good thing about using solder is the fact that it can be removed easily in a technique known as desoldering. This comes in handy if you need to remove a component or make a correction to your electronic circuit.

Basic Soldering For Electronics Pace Handbook Of North Africa

To desolder a joint, you will need solder wick which is also known as desoldering braid.

Step 1 – Place a piece of the desoldering braid on top of the joint/solder you want removed.

Step 2 – Heat your soldering iron and touch the tip to the top of the braid. This will heat the solder below which will then be absorbed into the desoldering braid. You can now remove the braid to see the solder has been extracted and removed. Be careful touching the braid when you are heating it because it will get hot.

Optional– If you have a lot of solder you want removed, you may want to use a device called a solder sucker. This is a handheld mechanical vacuum that sucks up hot solder with a press of a button.

To use, press the plunger down at the end of the solder sucker. Heat the joint with your soldering iron and place the tip of the solder sucker over the hot solder. Press the release button to suck up the liquid solder. In order to empty the solder sucker, press down on the plunger.

FREE – Learn To Solder Guide (17 pages)